Micron Technology 2GBIT NOR FLASH | MT25QL02GCBB8E12-0SIT

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8542.32.00.71

Automotive

No

PPAP

No

Cell Type

NOR

Chip Density (bit)

2G

Block Organization

Symmetrical

Location of Boot Block

Bottom|Top

Address Bus Width (bit)

32

Number of Bits/Word (bit)

1/2/4

Number of Words

2G/1G/512M

Programmability

Yes

Timing Type

Synchronous

Max. Access Time (ns)

7

Maximum Erase Time (S)

1/Sector

Maximum Programming Time (ms)

1.8/Page

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Maximum Operating Frequency (MHz)

133

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

94

Program Current (mA)

35

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Command Compatible

Yes

ECC Support

No

Support of Page Mode

No

Minimum Endurance (Cycles)

100000

Mounting

Surface Mount

Package Height

0.8

Package Width

6

Package Length

8

PCB changed

24

Standard Package Name

BGA

Supplier Package

TBGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

24

Architecture

Sectored

Sector Size

64Kbyte x 4096

Page Size

256byte

Boot Block

Yes